With the rapid development of electronic component technology and micro-assembly capabilities, the development of electronic equipment presents a trend of high integration, miniaturization and high frequency. The ensuing increase in the heat flux density of electronic devices poses a great challenge to the stability and service life of the devices. Therefore, effective heat dissipation and cooling methods and good cooling effects are the basis for ensuring high reliability and long-term operation of electronic equipment, which is more urgent and important for the development of electronic equipment.

With the increase in the heating power of electronic equipment components, natural cooling and air cooling technologies can no longer meet their heat dissipation requirements.

For air, the heat transfer coefficient of natural air cooling is very low, the maximum is 10w/(m2k). If the temperature difference between the surface of the radiator and the air is 50°C, the heat carried away by the air per square centimeter of the heat dissipation area is at most 0.05W. The heat transfer method with the strongest heat transfer ability is the heat transfer process with phase change, and the heat transfer coefficient of water is on the order of 103 to 104. The heat transfer capacity of the heat pipe is great because the heat transfer process in the evaporation section and the condensation section is a phase change heat transfer.

The air-cooled heat dissipation method has low cost and high reliability, but due to its small heat dissipation capacity, it is only suitable for the case where the heat dissipation power is small and the heat dissipation space is large. At present, the research focus of air-cooled radiators is to integrate heat pipes with radiator fins, and use the high heat transfer capacity of heat pipes to uniformly transmit heat to the surface of the fins, thereby improving the uniformity of the surface temperature of the fins and the heat dissipation efficiency of the radiator. The forced air convection cooling method is a commonly used heat dissipation method for power electronic components at present, and its common structure is the form of a radiator and a fan. Although the structure is convenient to implement and low in cost, its heat dissipation capacity is limited.

The liquid cooling technology is to exchange heat through the contact between the liquid cooling medium and the heat source, and then the heat is transferred out by the cooling liquid. Liquid has high heat transfer coefficient, good fluidity and stable working ability, which makes liquid cooling technology the first choice for electronic equipment cooling system. Liquid cooling technology is increasingly used for thermal management of electronic components. This type of cooling is a solution that ensures optimal energy efficiency while minimizing noise and space requirements.

Liquid cooled plate manufacturer recommendation

There is an excellent liquid cooled plate manufacturer, Sanqian Technology Co., Ltd., which sells high-quality water cooling plate. If you want to know more about it, or are interested in our products, you can visit the website of Sanqian Technology Co., Ltd to contact us.