The global ceramic packages market was valued at USD 4.2 billion in 2022 and is projected to reach USD 8.1 billion by 2032, exhibiting a compound annual growth rate (CAGR) of 5.80% during the forecast period (2023 - 2032). Ceramic packages are used to protect and package electronic components, such as integrated circuits (ICs), microelectromechanical systems (MEMS), and sensors. They are made...